IC Packaging Technology Expo (ICP) 2014
January 15 - 17, 2014
Tokyo , Japan
All kinds of products, technologies and services that can contribute to miniaturization and thinning of cutting-edge devices such as Semiconductors, LED, Power Devices, Sensors and MEMS will gather here. ICP is an essential business venue for the professionals from a variety of fields to seek for packaging technologies.
Visitor Profile
Professionals of semiconductor assembly & electronics manufacturers in fields such as:
Production/Manufacturing, Engineering, SMT, Design, R&D, Quality Control, Purchasing, etc.
Visitors are from:
Semiconductor Manufacturers
Assembly Manufacturers/SATS
Sensor Manufacturers
Set Manufacturers (in high-density SMT)
MEMS Devices/LED Manufacturers
Automotive Electronics Manufacturers
Visitor Profile
Professionals of semiconductor assembly & electronics manufacturers in fields such as:
Production/Manufacturing, Engineering, SMT, Design, R&D, Quality Control, Purchasing, etc.
Visitors are from:
Semiconductor Manufacturers
Assembly Manufacturers/SATS
Sensor Manufacturers
Set Manufacturers (in high-density SMT)
MEMS Devices/LED Manufacturers
Automotive Electronics Manufacturers
Venue
Location: Tokyo Big Sight
The West Exhibition Hall is a two-tier structure that consists of four halls that surround the Atrium. These halls are suitable for small-scale exhibitions and events. Both levels are equipped with..
Contact
3-11-1 Ariake, Koto-ku, 135-0063 Tokyo , Japan
+81-3-5530-1111
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