January 16 - 18, 2013    Tokyo , Japan
Gathers wide variety of Packaging Technologies for IC Devices!

All kinds of products, technologies and services that can contribute to miniaturization and thinning of cutting-edge devices such as Semiconductors, LED, Power Devices, Sensors and MEMS will gather here. ICP is an essential business venue for the professionals from a variety of fields to seek for packaging technologies.

Venue

Location: Tokyo Big Sight
The West Exhibition Hall is a two-tier structure that consists of four halls that surround the Atrium. These halls are suitable for small-scale exhibitions and events. Both levels are equipped with..
Contact 3-11-1 Ariake, Koto-ku, 135-0063 Tokyo , Japan
+81-3-5530-1111

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