October 24 - 27, 2013
TOPICS

A. Emerging Technologies & Trends in Advanced Packaging
B. Power Electronics and Microsystems Packaging
C. Assembly and Manufacturing Technology
D. Design of Electronic Circuits and Systems
E. Electronics Simulation & Modelling
F. Electronics Applications
G. Optoelectronics & Advanced Communication Packaging
H. Applied Reliability
I. Challenge in Global Education

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