IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME) 2012

The International Symposium for Design and Technology in Electronic Packaging (SIITME) is a premier Central European event in the field of electronics industry, being from 1995 a scientific forum for exchanging of information between academia and industry from Central and Eastern Europe on the topics related to their experimental and theoretical work in the field of electronics and micro-systems, manufacturing technologies and advanced packaging.

The symposium combines the oral and poster presentations, in an attractive configuration, as well as individual meetings between professors, students, senior and young scientists who can discuss scientific and educational issues and organize future national and international cooperation. It is our pleasure to encourage you to participate to SIITME 2012, organized by “1 DECEMBRIE 1918″ University of Alba Iulia and Politehnica University of Bucharest, a top class, four days scientific event, between 25th and 28th October, 2012.