2009 IEEE International Interconnect Technology Conference - IITC
conferences > Inventions, Innovations conferences > IITC - IEEE International Interconnect Technology Conference
June 1 - 3, 2009
Burlingame CA , USA
The twelfth annual IITC is sponsored by the IEEE Electron Devices Society and the Japan Society of Applied Physics as a premier conference for interconnect technology. It IITC provides a forum for professionals and researchers in semiconductor processing, advanced materials, equipment development, and interconnect systems to present and discuss exciting new science and technology.
The 2009 Conference will be held at the Royton Sapporo Hotel in Sapporo, Hokkaido, Japan. This will be the first time the conference will be held at an international location.
A Short Course addressing advanced interconnect process, design and reliability issues will once again be offered on the day preseding the conference (May 31). On June 1 and 2, the exhibit hall will feature displays of new products, processes, analytical methods and materials; and the popular Supplier Seminars will be held in the evenings on June 1 and/or 2.
The conference is soliciting papers addressing all aspects of interconnect technology. Regular papers, with 3-page abstracts, will be selected for either oral or poster presentation. The Organizing Committee explicitly requests contributions for new areas: memory, manufacturing, packaging and new materials. In addition to this, papers with 2-page abstracts will be selected for a special poster session for New Engineers and Students. The deadline for paper submissions is January 19, 2009.
The 2009 Conference will be held at the Royton Sapporo Hotel in Sapporo, Hokkaido, Japan. This will be the first time the conference will be held at an international location.
A Short Course addressing advanced interconnect process, design and reliability issues will once again be offered on the day preseding the conference (May 31). On June 1 and 2, the exhibit hall will feature displays of new products, processes, analytical methods and materials; and the popular Supplier Seminars will be held in the evenings on June 1 and/or 2.
The conference is soliciting papers addressing all aspects of interconnect technology. Regular papers, with 3-page abstracts, will be selected for either oral or poster presentation. The Organizing Committee explicitly requests contributions for new areas: memory, manufacturing, packaging and new materials. In addition to this, papers with 2-page abstracts will be selected for a special poster session for New Engineers and Students. The deadline for paper submissions is January 19, 2009.
Venue
Location: Hyatt Regency San Francisco Airport
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Contact
1333 Bayshore Highway, , California, USA 94010 Burlingame , USA
+1 650 347 1234
+1 650 347 1234
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