European 3D Summit 2016
January 19 - 20, 2016
NO CITY , フランス
This year’s 4th edition of the European 3D Summit will celebrate a rich diversity of 3D Integration technologies. Going beyond Through-Silicon-Via (TSV) technology, SEMI will invite a set of high-profile conference speakers to talk about the full range of cutting-edge technologies being adopted in 3D Integration and miniaturized packaging.
主催者
Semiconductor Equipment and Material International
San Jose
3081 Zanker Road
San Jose, CA 95134, USA
1.408.943.6900
関連イベント
European 3D Summit January 19 - 20, 2016