July 25 - 26, 2014
2014 International conference on Electrical Enginereing and Architectural Engineering (ICEEAE-2014) is being hold on 25-26th July ,2014 in Harbin China.

Sponsored by BOSI EDU conference organizer ICEEAE-2014 will continually provide a high-level international platform for researchers,engineers,as well as industrial professionals from all over the world to present their research results and development activities in the fields of Electrical Engineering and Architectural Engineering Related Issue.The organizing committee of conference is pleased to invite prospective authors to submit their original manuscripts to ICEEAE-2014.

All accepted papers of ICEEAE-2014 will be published in”Applied Mechanics and Materials”[ISSN:1660-9336,Trans Tech Publications].Applied mechanics and Materials a book series specialized in the rapid publication of proceedings of international conferences,workshops and symposia as well as state-of-art bolumes on topics of current interest in all areas of Electrical Engineering and Architectural Engineering.Indexed by Elsevier:SCOUPS and Ei Compendex(CPX),Cambridge Scientific Abstracts(CSA),Chemical Abstracts(CA),Google and Google Scholar google.com,ISI(ISTP,CPCI,Web of Science),Institution of Electrical Engineers(IEE),etc.For Reference:http://www.ttp.net/1660-9336.html

Improtant Date:
Paper Submission (Full Paper):June.30, 2014
Notification of Acceptance: July.7, 2014
Authors'Registration & Payment Deadline: July.17, 2014
Conference Date: July 25-26, 2014

Sede

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Organizzatore

BOSI EDU Shenyang Ltd.
024-83958379-803