Advanced Manufacturing in Semiconductors Asia 2011

With a cyclical and volatile market, the design, fabrication and manufacturing of semiconductor devices involves complex challenges. A distributed value chain involving various stakeholders further amplifies this, as the market requires constant innovation from industry players to adapt to shifting demands and technology change.

Advanced Manufacturing in Semiconductors Asia is set to address the current need for more information and increased collaboration, examining ways to re-engineer and improve operational processes and practices in semiconductor manufacturing.

Stretching across the value chain, with stakeholders participating from the front-end to back-end of manufacturing, the conference will discuss the likely future path for semiconductor manufacturing in Asia and include discussions on:

* Developing strategies to minimise the lack of skilled workforce and talent
* Addressing specific technology changes and challenges in wafer fabrication and packaging
* Streamlining of processes and elimination of redundancies for improved management of customer-facing parts of the value chain
* Implementing process improvement methodology and best practices for plant operations
* Deploying key strategic initiatives to ensure rapid work in progress turnover, faster cycle time and speed of delivery
* Translating research and development of new devices against product manufacturability