January 19 - 20, 2016    NO CITY , 法国
This year’s 4th edition of the European 3D Summit will celebrate a rich diversity of 3D Integration technologies. Going beyond Through-Silicon-Via (TSV) technology, SEMI will invite a set of high-profile conference speakers to talk about the full range of cutting-edge technologies being adopted in 3D Integration and miniaturized packaging.

场馆

Location: Minatec
联系 NO CITY , France

组织者

Semiconductor Equipment and Material International
San Jose 3081 Zanker Road San Jose, CA 95134, USA
1.408.943.6900

相关活动

European 3D Summit January 19 - 20, 2016