Bondexpo 2011

With their industry platform for industrial bonding technologies, namely BONDexpo , trade fair promoters P. E. Schall GmbH & Co. KG have succeeded in establishing a new type of “complementary trade fair” within a very short period of time. BONDexpo will take place for the fifth time in 2011. The event documents the necessity for looking beyond one’s own horizon in an impressive fashion, in order to be able to represent production and assembly technology sequences in their entirety.