November 4 - 6, 2016    Chengdu , 中華人民共和国
The conference will take place in Chengdu, China during Nov.4-6, 2016. ICSMS 2016 welcomes articles in the field of Smart Materials Science, dealing with new developments in theory, analytical and numerical simulation and modeling, experimentation, demonstration, advanced deployment and case studies, results of laboratory or field operational tests, under the general theme of Material Science and Engineering. ●Program Prerview Nov. 4, 2016: Registration + Opening Speech + KN Speeches+ Technical Sessions Nov. 5, 2016: Plenary Speeches+Invited Speech+ Technical Sessions+ Closing Ceremony Nov. 6, 2016: One day tour in Chengdu / Technical Tour (optional) ●Paper Submission 1, Papers can be submitted as PDF via EasyChair: http://www.easychair.org/conferences/?conf=icsms2016 2, You can also choose to submit your paper directly to [email protected] 3, Contributions must be written in English and report on original, unpublished work not submitted for publication elsewhere. Submissions not adhering to the above specified constraints may be rejected without review. 4, For author: Full paper should be submitted for review. For presenter: abstract should be submitted for review. CONTACT US Ms. Amber Cao Email: [email protected] Website: http://www.icsms.net/

開催地

Location: Xinhua International Hotel
連絡先 7 Guloudong St, Qingyang, , Sichuan, China, 610017 Chengdu , China
+86 28 8661 5858

主催者

Hong Kong Society of Mechanical Engineers
UNIT B, RM 06, 29/F, LEGEND TOWER, 7 SHIING YIP ST, KWUN TONG, KL, HONG KONG
+852-30697937

関連イベント