4 May, 2010    芝加哥 IL , 美国
Packaging Automation Forum, now in its fifth year, features peer-to-peer education about how to increase productivity, flexibility and performance using state-of-the-art packaging controls and information technology. This popular industry event provides a unique, focused learning and networking environment for designers, specifiers and buyers of packaging machinery and systems. Attendees will learn about products, technologies and strategies that can drive profitability and performance.

场馆

Location: InterContinental Chicago O’Hare Hotel
联系 5300 N. River Rd. Chicago , USA

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